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Akrion, Inc.(AKRI)

 
123Jump Rating:   Underwriters: Credit Suisse First Boston
      Deutsche Bank Sec.
Status: Filed  
 
Address: 6330 Hedgewood Dr, Ste.50
FiledDate: 05/14/2007
  Allentown,
   
  PA 18106
Filed Price Range ($):
       
Telephone: 610-391-9200 Filed Offer Amount ($ Million): $86.25
       
Fax: 610-391-1982 Shares Offered (Millions):
       
Websites: www.akrion.com Shares Outstanding (Millions):
       
Management: James Molinaro, Pres./CEO
IPO Date:
  James Whittle, CFO
   
  Final Offer Price ($): $0.00
       
Industry: Electronics Final Offer Size (Millions of Shares): 0.00
       
Employees: 344 Final Offer Amount ($ Million): $0.00
       
Competitors: SEMES Co, Inc.
S-1 Forms:
     
   
       
     
     
     
       
 
- Avoid        - Value Gap        - Short-Term Growth        - Long-Term Growth        - Long-Term Value

Company Links
Corporate / History Profile Executives Products Services
Quarterly Performance   

Qtr Ended

Revenues Net Income EPS
03 / 2003 5854 -4345
06 / 2003 7114 -3326
09 / 2003 10181 -2878
12 / 2003 9303 -1156
03 / 2004 14786 -1052
06 / 2004 19839 690
Major Stock Holders   (Prior To Offering)

Name

Dennis J. Fiore NA NA NA NA NA NA
James S. Molinaro NA NA NA NA NA NA
Richard E. Novak NA NA NA NA NA NA
Sunrise Capital Partners, L.P. NA NA NA NA NA NA
Westar Capital II, LLC NA NA NA NA NA NA

Business Environment

The semiconductor capital equipment industry is driven by the needs of semiconductor device manufacturers either to add manufacturing capacity or to invest in advanced manufacturing capabilities that utilize technological innovations. Many widely used products, including computers, mobile phones, televisions, audio systems and automobiles, use semiconductor devices. Advances in semiconductor design and manufacturing are enabling the increased sophistication of these consumer and industrial products.

According to a July 2004 report published by Gartner Dataquest, an independent semiconductor research firm, the size of the semiconductor capital equipment market in 2003 was $22.8 billion. Gartner forecasts revenue of $41.1 billion in 2006, representing a 21.7% compound annual growth rate from 2003 to 2006. The Company’s products serve the wet cleaning segment of the semiconductor capital equipment market. Gartner estimates that in 2003 the total addressable market for wet cleaning equipment was $966 million, and it forecasts this market will grow to $1.7 billion in 2006, representing a 20.5% compound annual growth rate from 2003 to 2006.

Advances in process technology are driving dramatic increases in the capital cost of making semiconductor devices. As a result, manufacturers are increasingly sensitive to their return on investment in new equipment, causing them to focus more closely on how their equipment purchases impact device yield and on-going costs of operation. Because cleaning is an integral and frequently repeated part of the manufacturing process, it is a principal area of focus for many semiconductor device manufacturers seeking to enhance their return on investment.

Company Strategy
The Company is a leading supplier of wet cleaning systems for the semiconductor industry. The Company designs, manufactures, installs and services advanced batch-immersion and single-wafer wet cleaning equipment.

Product/Services Portfolio
The Company offers a full line of batch-immersion and single-wafer wet cleaning systems.

GAMA is an automated batch-immersion system used to clean, etch and strip a wide variety of materials used in the integrated circuit manufacturing process. GAMA consists of an interconnected series of chemical and rinse process modules, each programmed to apply specific chemicals and, when appropriate, megasonic energy to the wafer surface in order to remove particles and other contaminants, etch deposited layers or strip photoresist from the wafer. Proprietary software controls the concentration and temperature of the chemicals used in each module as well as the robotic arm that moves the wafer batch trays from module to module.

V3 is a small batch-immersion system used for cleaning integrated circuits and other electronic substrates. V3 provides a solution for specialty, low-volume processing where a large-scale system is not required and where lower price and smaller footprint are relatively more important to the customer.

ClearIQ is a tool specifically designed to clean binary, phase-shift and extreme ultra-violet, or EUV, photomasks. ClearIQ utilizes a batch-immersion technology to clean binary/phase-shift masks and a dry-cleaning technology to clean EUV masks. ClearIQ uses a non-contact approach to remove particles from the photomask while maintaining the photomask’s required performance characteristics, thereby extending the life span of the photomask.

Goldfinger is a non-contact, single-wafer cleaning system utilizing patented megasonics technology and proprietary drying technology to provide integrated circuit cleaning at device geometries of 130nm and below. As device geometries become smaller, it becomes more difficult for traditional batch cleaning methods to remove particles from the narrow, deep trenches, called vias, that form the circuitry patterns on the wafer. Goldfinger’s megasonics technology is designed to penetrate and clean these recessed vias.

Investment Analysis
Revenue increased by $21.7 million, or 167%, to $34.6 million for the first six months of 2004 from $13.0 million for the first six months of 2003.

Cost of revenue increased by $12.6 million, or 107%, to $24.3 million for the first six months of 2004 from $11.7 million for the first six months of 2003.

Selling, general and administrative expense increased by $1.2 million, or 23%, to $6.5 million for the first six months of 2004 from $5.3 million for the first six months of 2003.

Research and development expense decreased by $0.3 million, or 9%, to $3.0 million for the first six months of 2004 from $3.4 million for the first six months of 2003.

Other expense, net was $0.7 million for the first six months of 2004, compared with $0.2 million for the first six months of 2003.

Income Data 
Year Revenues Costs Oper Income Taxes Net Income EPS
2001 65352263 26578873 -10262196 96967 -10797910 -28.78999999999999914734871708787977695465087890625
2002 39846770 26201579 -21443864 54273 -22430552 -14.8699999999999992184029906638897955417633056640625
2003 32451976 16822032 -10888104 111557 -11705377 -1.560000000000000053290705182007513940334320068359375
2004 34626235 9927297 378308 1798 -362443 -0.0200000000000000004163336342344337026588618755340576171875
*As of period Ended June 30, 2004

Balance Sheet Data

Year

Cash Acct Recv. Inventory Total Cur Assets Total Cur Liability PPE Total Assets LT Debt SH Equity
2002 918590 5536188 19350684 27083676 29261166 5874434 33181483 0.00 3920317
2003 347384 1446854 22654872 27051868 38900671 4169712 31429170 0.00 -7471501
2004 2976506 3084227 18456851 26096050 34912486 4663315 40158299 0.00 516698
*As of period Ended June 30, 2004

Cash Flow Summary

Year

Net Cash-Ops Net Cash-Inv Net Cash-Fin Net Change
2001 -13427706 -4194101 15657532 -2017329
2002 -15911556 -711092 16444809 -114162
2003 518277 -526750 -564447 -571206
2004 -4502968 -596098 7727599 2629122
*As of period Ended June 30, 2004
 

 

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